STMicroelectronics (ST) has signed a €1 billion credit facility agreement with the European Investment Bank (EIB) to reinforce the competitiveness and strategic autonomy of Europe’s semiconductor industry, according to recent industry reports.
This marks the ninth financing cooperation between ST and EIB since 1994, bringing their total collaboration financing to approximately €4.2 billion to date.
Under the new agreement, the first tranche of €500 million has already been finalized, earmarked to accelerate R&D activities and scale-up production capacities across ST’s key facilities in Italy and France. Approximately 60% of the funding is allocated to capacity expansion in strategic manufacturing hubs in Catania and Agrate (Italy) and Grenoble (France), while the remaining 40% will support the development of advanced semiconductor technologies and devices.
Gelsomina Vigliotti, Vice-President of the European Investment Bank, underscored the importance of Europe’s leadership in semiconductor innovation for maintaining competitiveness, supply chain resilience, and achieving climate and digital transition objectives. The financing initiative reaffirms EIB’s commitment to backing strategic industries and strengthening Europe’s technological sovereignty.
STMicroelectronics President and CEO, Jean-Marc Chery, noted that the funding will bolster the company’s efforts to enhance differentiated technology development and volume manufacturing capabilities across its European ecosystem
Ahead of signing the agreement, a senior EIB delegation visited ST’s Catania manufacturing site — a facility encompassing a full silicon carbide (SiC) value chain and identified as a key investment area for cutting-edge semiconductor production.
Conclusion
This latest financing collaboration not only strengthens the long-standing strategic partnership between STMicroelectronics and the European Investment Bank but also advances Europe’s ambition to build a more autonomous, globally competitive semiconductor industry.