According to the latest semiconductor supply chain reports, tightening capacity in advanced nodes and packaging has driven leading chip designers to reassess their manufacturing partners, with several industry heavyweights now exploring alternatives involving Intel’s process and advanced packaging technologies.
Supply Constraints Trigger Strategic Shifts
The ongoing capacity crunch at traditional foundries—especially in both leading-edge process nodes and advanced packaging—has prompted major players such as NVIDIA and AMD to actively evaluate Intel’s Intel 14A process for potential foundry engagements. Likewise, Apple and Broadcom are considering Intel’s EMIB advanced packaging for customized server chip designs.
Industry insiders point out that while demand for AI and high-performance compute chips continues to surge, limited wafer fabrication and packaging capacities have become key bottlenecks for design houses.
Apple & Broadcom Supply Chain Adjustments
Apple has reportedly begun evaluating Intel’s process technology, having completed initial tests on the Intel 18A-P PDK 0.9.1 and awaiting updated PDK versions slated for release in Q1 2026, enabling broader verification efforts.
Moreover, a custom Apple server chip code-named “Baltra”—initially slated for TSMC N3—may pivot toward Intel’s EMIB packaging due to ongoing capacity limitations in TSMC’s CoWoS advanced packaging line. If design tools and yield meet expectations, this custom AI server chip could enter volume production by 2028, while “M Series” chips on Intel process might appear as early as 2027.
Intel’s Strategic Opportunity
For Intel, the renewed interest from external design customers underscores the value of years of R&D investments and extensive capital deployment. Intel positions its 14A process and advanced packaging capabilities as competitive differentiators in attracting foundry customers. Success in securing design wins from NVIDIA, AMD, or others could significantly bolster its role in the global wafer foundry ecosystem.
Industry Outlook
Although these engagements remain under evaluation, the trend highlights an industry increasingly focused on supply chain diversification in response to AI-driven demand surges. Continued capacity constraints at traditional providers may accelerate alternative foundry and packaging partnerships in the years to come.