
| Type | Description |
|---|---|
| Series: | R500 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | Solder Paste |
| Composition: | Sn96.5Ag3.0Cu0.5 (96.5/3.0/0.5) |
| Diameter: | - |
| Melting Point: | 423 ~ 424°F (217 ~ 218°C) |
| Flux Type: | Water Soluble |
| Wire Gauge: | - |
| Process: | Lead Free |
| Form: | Syringe, 1.23 oz (35g), 10cc |
| Shelf Life: | 6 Months |
| Shelf Life Start: | Date of Manufacture |
| Storage/Refrigeration Temperature: | 32°F ~ 50°F (0°C ~ 10°C) |
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ||
| 5 | ||
| 10 | ||
| 25 | ||
| 50 | ||
| 100 |
Current price of 70-1709-0820 is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com
SOLDER 500G JAR, SN63/PB37
SOLDER PASTE NO CLEAN 500GM
SMOOTH FLOW LOW TEMP SOLDER PAST
SOLDER PASTE WATER SOLUBLE 35GM
IC MCU 32BIT 256KB FLASH 64QFN
IC MCU 32BIT 1MB FLASH 144LQFP
FIXED IND 150UH 550MA 520 MOHM