
| Type | Description |
|---|---|
| Series: | R500 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | Solder Paste |
| Composition: | Sn96.5Ag3.0Cu0.5 (96.5/3.0/0.5) |
| Diameter: | - |
| Melting Point: | 423 ~ 424°F (217 ~ 218°C) |
| Flux Type: | Water Soluble |
| Wire Gauge: | - |
| Process: | Lead Free |
| Form: | Syringe, 1.23 oz (35g), 10cc |
| Shelf Life: | 6 Months |
| Shelf Life Start: | Date of Manufacture |
| Storage/Refrigeration Temperature: | 32°F ~ 50°F (0°C ~ 10°C) |
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ||
| 5 | ||
| 10 | ||
| 25 | ||
| 50 | ||
| 100 |
Current price of 70-1709-0820 is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com
SOLDER 500G JAR, SN63/PB37
SOLDER PASTE NO CLEAN 500GM
SMOOTH FLOW LOW TEMP SOLDER PAST
SOLDER PASTE WATER SOLUBLE 35GM
DIODE GEN PURP 200V 1A SOD123W
CONN HDR DIP POST 2POS TIN
CONN HDR STRIP FORK 14POS GOLD