
| Type | Description |
|---|---|
| Series: | R500 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | Solder Paste |
| Composition: | Sn96.5Ag3.0Cu0.5 (96.5/3.0/0.5) |
| Diameter: | - |
| Melting Point: | 423 ~ 424°F (217 ~ 218°C) |
| Flux Type: | Water Soluble |
| Wire Gauge: | - |
| Process: | Lead Free |
| Form: | Syringe, 1.23 oz (35g), 10cc |
| Shelf Life: | 6 Months |
| Shelf Life Start: | Date of Manufacture |
| Storage/Refrigeration Temperature: | 32°F ~ 50°F (0°C ~ 10°C) |
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ||
| 5 | ||
| 10 | ||
| 25 | ||
| 50 | ||
| 100 |
Current price of 70-1709-0820 is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com
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