
| Type | Description |
|---|---|
| Series: | PLS |
| Package: | Bulk |
| Part Status: | Active |
| Type: | PGA, ZIF (ZIP) |
| Number of Positions or Pins (Grid): | - |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 30.0µin (0.76µm) |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Closed Frame |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Tin |
| Contact Finish Thickness - Post: | 200.0µin (5.08µm) |
| Contact Material - Post: | Beryllium Copper |
| Housing Material: | Polyphenylene Sulfide (PPS) |
| Operating Temperature: | -65°C ~ 125°C |
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ||
| 2 |
Current price of 100-PLS10001-12 is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com
CONN SOCKET LGA 3647POS GOLD
CONN IC DIP SOCKET 16POS GOLD
CONN IC DIP SOCKET 20POS GOLD
DIODE TVS 250V 600W SMB BI-DIR
CONN SOCKET PGA ZIF GOLD
BOX STEEL GRAY 10"L X 4"W
BUFFER/INVERTER MOSFET DRIVER