
| Type | Description |
|---|---|
| Series: | - |
| Package: | Tray |
| Part Status: | Active |
| Type: | LGA |
| Number of Positions or Pins (Grid): | 3647 |
| Pitch - Mating: | - |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 30.0µin (0.76µm) |
| Contact Material - Mating: | Copper Alloy |
| Mounting Type: | Surface Mount |
| Features: | Open Frame |
| Termination: | Solder |
| Pitch - Post: | - |
| Contact Finish - Post: | - |
| Contact Finish Thickness - Post: | - |
| Contact Material - Post: | Copper Alloy |
| Housing Material: | Thermoplastic |
| Operating Temperature: | - |
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ||
| 12 | ||
| 36 | ||
| 60 | ||
| 108 | ||
| 252 |
Current price of 2-2129710-6 is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com
CONN IC DIP SOCKET 16POS GOLD
CONN IC DIP SOCKET 20POS GOLD
CONN IC DIP SOCKET 28POS GOLD
FIXED IND 68UH 1.2A 240 MOHM SMD
CONN RCP HSG FMALE 10POS INLINE
CONN SOCKET LGA 3647POS GOLD
XTAL OSC XO 751.2340KHZ HCMOS