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Type | Description |
---|---|
Series: | Z-PACK HS3 |
Package: | Tube |
Part Status: | Active |
Connector Usage: | Backplane |
Connector Type: | Header, Male Pins and Blades |
Connector Style: | Dual Beam, Center |
Number of Positions: | 30 |
Number of Positions Loaded: | All |
Pitch: | 0.098" (2.50mm) |
Number of Rows: | 6 |
Number of Columns: | 5 |
Mounting Type: | Through Hole |
Termination: | Press-Fit |
Contact Layout, Typical: | - |
Features: | - |
Contact Finish: | Gold |
Contact Finish Thickness: | 30.0µin (0.76µm) |
Color: | - |
RES 39 OHM 1% 3/4W 2010
MEMS OSC XO 66.0000MHZ LVCMOS LV
MOSFET N-CH 40V 75A DPAK
CONN HEADER DUAL BEAM 30POS PCB