
| Type | Description |
|---|---|
| Series: | 110 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | DIP, 0.3" (7.62mm) Row Spacing |
| Number of Positions or Pins (Grid): | 16 (2 x 8), 8 Loaded |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | Flash |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Open Frame |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Tin |
| Contact Finish Thickness - Post: | - |
| Contact Material - Post: | Brass |
| Housing Material: | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
| Operating Temperature: | -55°C ~ 125°C |
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ||
| 825 |
Current price of 110-87-316-10-003101 is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com
CONN IC DIP SOCKET 42POS GOLD
CONN IC DIP SOCKET 22POS GOLD
CONN IC DIP SOCKET 32POS GOLD
XTAL OSC XO 18.9568MHZ CMOS SMD
CONN CARDEDGE MALE 36POS 0.100
CONN IC DIP SOCKET 16POS GOLD
SLEEVING 3/4" X 250' BLACK/WHITE