
| Type | Description |
|---|---|
| Series: | 116 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | DIP, 0.6" (15.24mm) Row Spacing |
| Number of Positions or Pins (Grid): | 32 (2 x 16) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | Flash |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Elevated, Open Frame |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Tin |
| Contact Finish Thickness - Post: | - |
| Contact Material - Post: | Brass |
| Housing Material: | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
| Operating Temperature: | -55°C ~ 125°C |
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ||
| 247 |
Current price of 116-87-632-41-003101 is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com
CONN IC DIP SOCKET 40POS TIN
CONN IC DIP SOCKET 18POS GOLD
CONN IC DIP SOCKET 24POS GOLD
CRYSTAL 25.0000MHZ 10PF SMD
XTAL OSC VCXO 74.2500MHZ LVPECL
MEMS OSC XO 38.4000MHZ H/LV-CMOS
CONN IC DIP SOCKET 32POS GOLD