
| Type | Description |
|---|---|
| Series: | - |
| Package: | Bulk |
| Part Status: | Active |
| Type: | LGA |
| Number of Positions or Pins (Grid): | 2011 (47 x 58) |
| Pitch - Mating: | 0.040" (1.02mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 15.0µin (0.38µm) |
| Contact Material - Mating: | Copper Alloy |
| Mounting Type: | Surface Mount |
| Features: | Open Frame |
| Termination: | Solder |
| Pitch - Post: | 0.035" (0.90mm) |
| Contact Finish - Post: | Gold |
| Contact Finish Thickness - Post: | 15.0µin (0.38µm) |
| Contact Material - Post: | Copper Alloy |
| Housing Material: | Thermoplastic |
| Operating Temperature: | - |
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ||
| 10 | ||
| 25 | ||
| 50 | ||
| 100 | ||
| 250 | ||
| 500 |
Current price of 2201838-1 is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com
CONN IC DIP SOCKET 16POS GOLD
CONN IC DIP SOCKET 40POS GOLD
CONN IC DIP SOCKET 28POS GOLD
IGBT TRENCH 600V 24A TO220AB
CONN SOCKET LGA 2011POS GOLD
COLOURED SURROUND FOR TOUCH SENS
DIODE