
| Type | Description |
|---|---|
| Series: | 500 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | SIP |
| Number of Positions or Pins (Grid): | 10 (1 x 10) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | - |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | - |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Gold |
| Contact Finish Thickness - Post: | - |
| Contact Material - Post: | Beryllium Copper |
| Housing Material: | Thermoplastic |
| Operating Temperature: | - |
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ||
| 10 | ||
| 48 | ||
| 96 | ||
| 144 | ||
| 288 | ||
| 528 | ||
| 1008 | ||
| 2544 |
Current price of 510-AG90D-10 is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com
CONN IC DIP SOCKET 10POS GOLD
CONN IC DIP SOCKET 16POS GOLD
IC SOCKET, DIP, 16P 2.54MM PITCH
CONN DIP HDR IDC 20POS VERT
CONN DIP HDR IDC 26POS VERT
CONN SOCKET SIP 10POS GOLD
CONN SOCKET SOIC 16POS GOLD