
| Type | Description |
|---|---|
| Series: | 500 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | SIP |
| Number of Positions or Pins (Grid): | 10 (1 x 10) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | - |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | - |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Gold |
| Contact Finish Thickness - Post: | - |
| Contact Material - Post: | Beryllium Copper |
| Housing Material: | Thermoplastic |
| Operating Temperature: | - |
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ||
| 10 | ||
| 48 | ||
| 96 | ||
| 144 | ||
| 288 | ||
| 528 | ||
| 1008 | ||
| 2544 |
Current price of 510-AG90D-10 is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com
CONN IC DIP SOCKET 10POS GOLD
CONN IC DIP SOCKET 16POS GOLD
IC SOCKET, DIP, 16P 2.54MM PITCH
TVS DIODE 8V 13.6V DO214AA
CONN SOCKET SIP 10POS GOLD
CONN SMA PLUG RCPT
CONN TRS JACK STR SOLDER