
| Type | Description |
|---|---|
| Series: | - |
| Package: | Tray |
| Part Status: | Active |
| Type: | Transistor |
| Number of Positions or Pins (Grid): | 3 (Rectangular) |
| Pitch - Mating: | - |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 30.0µin (0.76µm) |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Board Guide |
| Termination: | Solder |
| Pitch - Post: | - |
| Contact Finish - Post: | Gold |
| Contact Finish Thickness - Post: | 30.0µin (0.76µm) |
| Contact Material - Post: | Beryllium Copper |
| Housing Material: | Polyphenylene Sulfide (PPS) |
| Operating Temperature: | -55°C ~ 175°C |
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ||
| 10 | ||
| 30 | ||
| 50 | ||
| 100 | ||
| 250 | ||
| 500 | ||
| 1000 |
Current price of TDU03DTON is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com
CONN IC DIP SOCKET 22POS TINLEAD
CONN IC DIP SOCKET ZIF 16POS GLD
CONN IC DIP SOCKET 20POS GOLD
RES SMD 18 OHM 1% 1/16W 0402
CONN SOCKET TRANSIST 3POS GOLD
RES SMD 2.87K OHM 0.5% 1/8W 1206
CAP CER 39PF 100V NP0 RADIAL