
| Type | Description |
|---|---|
| Series: | Lo-PRO®file, 526 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | DIP, ZIF (ZIP) |
| Number of Positions or Pins (Grid): | 28 (2 x 14) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Tin |
| Contact Finish Thickness - Mating: | 10.0µin (0.25µm) |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Closed Frame |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Tin |
| Contact Finish Thickness - Post: | 10.0µin (0.25µm) |
| Contact Material - Post: | Beryllium Copper |
| Housing Material: | Polyamide (PA46), Nylon 4/6, Glass Filled |
| Operating Temperature: | -55°C ~ 105°C |
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ||
| 25 | ||
| 100 | ||
| 500 | ||
| 1000 |
Current price of 28-526-10 is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com
CONN IC DIP SOCKET 6POS GOLD
CONN IC DIP SOCKET 16POS GOLD
CONN IC DIP SOCKET 10POS GOLD
RES SMD 160 OHM 0.25% 1/4W 1206
MOSFET N-CH 400V 5.6A DPAK
CONN IC DIP SOCKET ZIF 28POS TIN
0.50SQR6061T6511-10 1/2" X 1/2"