
| Type | Description |
|---|---|
| Series: | Lo-PRO®file, 526 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | DIP, ZIF (ZIP) |
| Number of Positions or Pins (Grid): | 28 (2 x 14) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Tin |
| Contact Finish Thickness - Mating: | 10.0µin (0.25µm) |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Closed Frame |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Tin |
| Contact Finish Thickness - Post: | 10.0µin (0.25µm) |
| Contact Material - Post: | Beryllium Copper |
| Housing Material: | Polyamide (PA46), Nylon 4/6, Glass Filled |
| Operating Temperature: | -55°C ~ 105°C |
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ||
| 25 | ||
| 100 | ||
| 500 | ||
| 1000 |
Current price of 28-526-10 is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com
CONN IC DIP SOCKET 6POS GOLD
CONN IC DIP SOCKET 16POS GOLD
CONN IC DIP SOCKET 10POS GOLD
XTAL OSC VCXO 128.0000MHZ LVPECL
CONN RCPT IMPACT 180POS EDGE MNT
CONN IC DIP SOCKET ZIF 28POS TIN
XTAL OSC XO 250.0000MHZ LVDS SMD