
| Type | Description |
|---|---|
| Series: | 800 |
| Package: | Tube |
| Part Status: | Active |
| Type: | DIP, 0.6" (15.24mm) Row Spacing |
| Number of Positions or Pins (Grid): | 24 (2 x 12) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | Flash |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Open Frame |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Gold |
| Contact Finish Thickness - Post: | Flash |
| Contact Material - Post: | Copper |
| Housing Material: | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
| Operating Temperature: | -55°C ~ 105°C |
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ||
| 20 | ||
| 40 | ||
| 60 | ||
| 100 | ||
| 260 | ||
| 500 | ||
| 1000 | ||
| 2500 |
Current price of 824-AG11D-ESL-LF is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com
CONN IC DIP SOCKET 48POS GOLD
CONN IC DIP SOCKET 24POS GOLD
CONN IC DIP SOCKET 10POS GOLD
MEMS OSC XO 66.0000MHZ LVCMOS LV
XTAL OSC VCXO 445.5000MHZ HCSL
MEMS OSC XO 48.0048MHZ SMD
CONN IC DIP SOCKET 24POS GOLD