
| Type | Description |
|---|---|
| Series: | - |
| Package: | Tray |
| Part Status: | Active |
| Type: | Transistor, TO-254 |
| Number of Positions or Pins (Grid): | 3 (Rectangular) |
| Pitch - Mating: | 0.150" (3.81mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 30.0µin (0.76µm) |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Flange |
| Termination: | Solder |
| Pitch - Post: | 0.150" (3.81mm) |
| Contact Finish - Post: | Gold |
| Contact Finish Thickness - Post: | 30.0µin (0.76µm) |
| Contact Material - Post: | Beryllium Copper |
| Housing Material: | Polyphenylene Sulfide (PPS) |
| Operating Temperature: | -50°C ~ 175°C |
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ||
| 10 |
Current price of TMJ03DKSD-S1512 is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com
CONN IC DIP SOCKET 6POS GOLD
CONN IC DIP SOCKET 24POS TIN
CONN IC DIP SOCKET 16POS TIN
CRYSTAL 24.5760MHZ 18PF SMD
CONN HEADER VERT 12POS 2.54MM
CONN TRANSIST TO-254 3POS GOLD
SLEEVE, 0.375 IN DIA X 0.75 IN W