
| Type | Description |
|---|---|
| Series: | 116 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | DIP, 0.2" (5.08mm) Row Spacing |
| Number of Positions or Pins (Grid): | 10 (2 x 5) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | Flash |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Elevated, Open Frame |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Tin |
| Contact Finish Thickness - Post: | - |
| Contact Material - Post: | Brass |
| Housing Material: | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
| Operating Temperature: | -55°C ~ 125°C |
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ||
| 390 |
Current price of 116-87-210-41-004101 is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com
CONN IC DIP SOCKET 30POS GOLD
CONN IC DIP SOCKET 50POS TINLEAD
CONN IC DIP SOCKET 24POS GOLD
MEMS OSC XO 35.8400MHZ LVCMOS LV
CONN RCPT 48POS 0.1 GOLD PCB
CONN IC DIP SOCKET 10POS GOLD
CONN RCPT FMALE 10POS CRIMP