
| Type | Description |
|---|---|
| Series: | 116 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | DIP, 0.3" (7.62mm) Row Spacing |
| Number of Positions or Pins (Grid): | 12 (2 x 6) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 29.5µin (0.75µm) |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Elevated, Open Frame |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Tin |
| Contact Finish Thickness - Post: | - |
| Contact Material - Post: | Brass |
| Housing Material: | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
| Operating Temperature: | -55°C ~ 125°C |
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ||
| 210 |
Current price of 116-83-312-41-013101 is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com
CONN IC DIP SOCKET 26POS GOLD
CONN IC DIP SOCKET 20POS TINLEAD
CONN SOCKET PLCC 32POS TIN
CONN HEADER VERT 40POS 2.54MM
CONN IC DIP SOCKET 12POS GOLD
SELF WRAP 6" X 25' BLACK
TERM BLOCK HDR 12POS 5.08MM