| Type | Description |
|---|---|
| Series: | 500 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | DIP, 0.4" (10.16mm) Row Spacing |
| Number of Positions or Pins (Grid): | 24 (2 x 12) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 25.0µin (0.63µm) |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Closed Frame |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | - |
| Contact Finish Thickness - Post: | - |
| Contact Material - Post: | Brass |
| Housing Material: | - |
| Operating Temperature: | -55°C ~ 125°C |
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ||
| 20 | ||
| 40 | ||
| 60 | ||
| 100 | ||
| 260 | ||
| 500 | ||
| 1000 | ||
| 2500 |
Current price of 524-AG10D-ES is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com
CONN IC DIP SOCKET 32POS GOLD
CONN SOCKET SIP 21POS GOLD
CONN SOCKET SIP 57POS GOLD
CAP CER 22UF 10V X7R 1206
LED XLAMP WARM WHITE 2SMD
CONN IC DIP SOCKET 24POS GOLD
DANGER PLASTIC SIGN 12" X 18"
