
| Type | Description |
|---|---|
| Series: | 500 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | DIP, 0.4" (10.16mm) Row Spacing |
| Number of Positions or Pins (Grid): | 24 (2 x 12) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 25.0µin (0.63µm) |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Closed Frame |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | - |
| Contact Finish Thickness - Post: | - |
| Contact Material - Post: | Brass |
| Housing Material: | - |
| Operating Temperature: | -55°C ~ 125°C |
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ||
| 20 | ||
| 40 | ||
| 60 | ||
| 100 | ||
| 260 | ||
| 500 | ||
| 1000 | ||
| 2500 |
Current price of 524-AG10D-ES is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com
CONN IC DIP SOCKET 32POS GOLD
CONN SOCKET SIP 21POS GOLD
CONN SOCKET SIP 57POS GOLD
FIXED IND 8.2MH 80MA 31 OHM SMD
CRYSTAL 22.6278MHZ 12PF SMD
CONN IC DIP SOCKET 24POS GOLD
CHAMP .050 DUST COVER,RCPT HSG