
| Type | Description |
|---|---|
| Series: | 500 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | DIP, 0.4" (10.16mm) Row Spacing |
| Number of Positions or Pins (Grid): | 24 (2 x 12) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 25.0µin (0.63µm) |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Closed Frame |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | - |
| Contact Finish Thickness - Post: | - |
| Contact Material - Post: | Brass |
| Housing Material: | - |
| Operating Temperature: | -55°C ~ 125°C |
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ||
| 20 | ||
| 40 | ||
| 60 | ||
| 100 | ||
| 260 | ||
| 500 | ||
| 1000 | ||
| 2500 |
Current price of 524-AG10D-ES is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com
CONN IC DIP SOCKET 32POS GOLD
CONN SOCKET SIP 21POS GOLD
CONN SOCKET SIP 57POS GOLD
LED XLAMP NEUTRAL WHT 4000K 2SMD
CONTACT,SKT,SIZE #0
CONN IC DIP SOCKET 24POS GOLD
DIE FIXTURE W/ DIE SET