
| Type | Description |
|---|---|
| Series: | 800 |
| Package: | Tube |
| Part Status: | Active |
| Type: | DIP, 0.6" (15.24mm) Row Spacing |
| Number of Positions or Pins (Grid): | 48 (2 x 24) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 25.0µin (0.63µm) |
| Contact Material - Mating: | Copper Alloy |
| Mounting Type: | Through Hole |
| Features: | Open Frame |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Tin-Lead |
| Contact Finish Thickness - Post: | - |
| Contact Material - Post: | Copper Alloy |
| Housing Material: | Polyester |
| Operating Temperature: | -55°C ~ 105°C |
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ||
| 250 |
Current price of 848-AG11D-ES is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com
CONN IC DIP SOCKET 12POS GOLD
CONN IC DIP SOCKET 24POS GOLD
CONN SOCKET SIP 37POS GOLD
FIXED IND 2.2UH 2.8A 39.6 MOHM
CONN IC DIP SOCKET 48POS GOLD
TEST LEAD BANANA TO BANANA 24"
FIXED IND 150NH 1.23A 100 MOHM