
| Type | Description |
|---|---|
| Series: | 116 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | DIP, 0.3" (7.62mm) Row Spacing |
| Number of Positions or Pins (Grid): | 10 (2 x 5) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 29.5µin (0.75µm) |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Elevated, Open Frame |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Tin |
| Contact Finish Thickness - Post: | - |
| Contact Material - Post: | Brass |
| Housing Material: | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
| Operating Temperature: | -55°C ~ 125°C |
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ||
| 462 |
Current price of 116-83-310-41-008101 is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com
CONN IC DIP SOCKET 28POS TIN
CONN IC DIP SOCKET 36POS GOLD
CONN SOCKET SIP 4POS GOLD
CRYSTAL 37.0500MHZ 6PF SMD
CONN IC DIP SOCKET 10POS GOLD
DC DC CONVERTER 12V 75W
DC DC CONVERTER 95V 50W