
| Type | Description |
|---|---|
| Series: | 0503 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | SIP |
| Number of Positions or Pins (Grid): | 25 (1 x 25) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 30.0µin (0.76µm) |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | - |
| Termination: | Wire Wrap |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Tin |
| Contact Finish Thickness - Post: | 200.0µin (5.08µm) |
| Contact Material - Post: | Brass |
| Housing Material: | Polyamide (PA), Nylon, Glass Filled |
| Operating Temperature: | - |
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ||
| 25 | ||
| 100 | ||
| 500 | ||
| 1000 |
Current price of 25-0503-30 is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com
CONN IC DIP SOCKET 22POS GOLD
CONN IC DIP SOCKET 40POS GOLD
CONN IC DIP SOCKET 10POS GOLD
MEMS OSC XO 60.0000MHZ LVCMOS LV
XTAL OSC VCXO 128.0000MHZ LVPECL
CONN SOCKET SIP 25POS GOLD
3/16 HEX X 1.00 LENGTH