
| Type | Description |
|---|---|
| Series: | Textoolâ„¢ |
| Package: | Bulk |
| Part Status: | Active |
| Type: | QFN |
| Number of Positions or Pins (Grid): | 88 (4 x 22) |
| Pitch - Mating: | 0.016" (0.40mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | - |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Open Frame |
| Termination: | Solder |
| Pitch - Post: | 0.016" (0.40mm) |
| Contact Finish - Post: | Gold |
| Contact Finish Thickness - Post: | - |
| Contact Material - Post: | Beryllium Copper |
| Housing Material: | Polyethersulfone (PES) |
| Operating Temperature: | - |
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ||
| 10 | ||
| 25 | ||
| 50 |
Current price of 288-4205-01 is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com
CONN IC DIP SOCKET 24POS GOLD
CONN IC DIP SOCKET 24POS GOLD
CONN IC DIP SOCKET 24POS GOLD
RES 129K OHM 0.25% 1/16W 0402
XTAL OSC XO 575.0000MHZ LVPECL
CONN SOCKET QFN 88POS GOLD
CAP FILM 0.22UF 10% 250VDC RAD