
| Type | Description |
|---|---|
| Series: | 612 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | DIP, 0.6" (15.24mm) Row Spacing |
| Number of Positions or Pins (Grid): | 50 (2 x 25) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 29.5µin (0.75µm) |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Carrier, Open Frame |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Tin |
| Contact Finish Thickness - Post: | - |
| Contact Material - Post: | Brass |
| Housing Material: | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
| Operating Temperature: | -55°C ~ 125°C |
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ||
| 136 |
Current price of 612-83-650-41-001101 is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com
CONN ZIG-ZAG ZIF 51POS GOLD
IC SOCKET, DIP, 14P 2.54MM PITCH
CONN IC DIP SOCKET 8POS TIN
MEMS OSC DCXO 148.5000MHZ LVDS
XTAL OSC XO 24.5400MHZ HCMOS TTL
CONN IC DIP SOCKET 50POS GOLD
CONN TERM BLK FEED THRU 6-12 AWG