| Type | Description |
|---|---|
| Series: | - |
| Package: | Tray |
| Part Status: | Active |
| Type: | LGA |
| Number of Positions or Pins (Grid): | 2011 (47 x 58) |
| Pitch - Mating: | - |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 15.0µin (0.38µm) |
| Contact Material - Mating: | Copper Alloy |
| Mounting Type: | Surface Mount |
| Features: | Open Frame |
| Termination: | Solder |
| Pitch - Post: | - |
| Contact Finish - Post: | Gold |
| Contact Finish Thickness - Post: | 15.0µin (0.38µm) |
| Contact Material - Post: | Copper Alloy |
| Housing Material: | Thermoplastic |
| Operating Temperature: | -25°C ~ 100°C |
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ||
| 10 | ||
| 30 | ||
| 50 | ||
| 100 | ||
| 250 | ||
| 500 |
Current price of 1554653-1 is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com
CONN IC DIP SOCKET 28POS GOLD
CONN IC DIP SOCKET 22POS GOLD
SOCKET-MINI-DIP 8-PIN
RES 0.05 OHM 1% 1/2W 1206
CONN SOCKET LGA 2011POS GOLD
CONN RCPT FMALE 3POS GOLD CRIMP
CONN RCPT FMALE 6POS GOLD CRIMP
