
| Type | Description |
|---|---|
| Series: | Textoolâ„¢ |
| Package: | Bulk |
| Part Status: | Active |
| Type: | QFN |
| Number of Positions or Pins (Grid): | 60 (4 x 15) |
| Pitch - Mating: | 0.016" (0.40mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | - |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Open Frame |
| Termination: | Solder |
| Pitch - Post: | 0.016" (0.40mm) |
| Contact Finish - Post: | Gold |
| Contact Finish Thickness - Post: | - |
| Contact Material - Post: | Beryllium Copper |
| Housing Material: | Polyethersulfone (PES) |
| Operating Temperature: | - |
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ||
| 10 | ||
| 25 | ||
| 50 | ||
| 100 |
Current price of 260-4204-01 is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com
CONN IC DIP SOCKET 14POS GOLD
CONN IC DIP SOCKET 16POS GOLD
CONN IC DIP SOCKET 8POS GOLD
RES SMD 10.7 OHM 1% 1/4W 1206
TVS DIODE 18.7V 31V DO219AB
XTAL OSC VCXO 100.0000MHZ LVPECL
CONN SOCKET QFN 60POS GOLD