
| Type | Description |
|---|---|
| Series: | 110 |
| Package: | Tube |
| Part Status: | Active |
| Type: | DIP, 0.9" (22.86mm) Row Spacing |
| Number of Positions or Pins (Grid): | 52 (2 x 26) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Tin-Lead |
| Contact Finish Thickness - Mating: | 200.0µin (5.08µm) |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Open Frame |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Tin-Lead |
| Contact Finish Thickness - Post: | 200.0µin (5.08µm) |
| Contact Material - Post: | Brass Alloy |
| Housing Material: | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
| Operating Temperature: | -55°C ~ 125°C |
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ||
| 56 |
Current price of 110-99-952-41-001000 is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com
CONN IC DIP SOCKET 28POS GOLD
CONN IC DIP SOCKET 64POS GOLD
CONN IC DIP SOCKET 28POS GOLD
MEMS OSC XO 66.6000MHZ LVCMOS LV
TERM BLOCK HDR 12POS VERT 3.81MM
CONN FFC BOTTOM 8POS 1.00MM R/A
CONN IC DIP SOCKET 52POS TINLEAD