
| Type | Description |
|---|---|
| Series: | Textool™ |
| Package: | Bulk |
| Part Status: | Active |
| Type: | PGA, ZIF (ZIP) |
| Number of Positions or Pins (Grid): | 625 (25 x 25) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 30.0µin (0.76µm) |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | - |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Gold |
| Contact Finish Thickness - Post: | 30.0µin (0.76µm) |
| Contact Material - Post: | Beryllium Copper |
| Housing Material: | Polyethersulfone (PES) |
| Operating Temperature: | -55°C ~ 150°C |
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ||
| 10 | ||
| 25 | ||
| 50 | ||
| 100 |
Current price of 200-6325-9UN-1900 is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com
CONN SOCKET QFN 56POS GOLD
CONN IC DIP SOCKET 28POS GOLD
CONN IC DIP SOCKET 10POS GOLD
XTAL OSC VCXO 160.0000MHZ LVDS
CONN SOCKET PGA ZIF 625POS GOLD
FIXED IND
1/4" R SERIES PHONE 90' STEREO G