
| Type | Description |
|---|---|
| Series: | - |
| Package: | Tray |
| Part Status: | Active |
| Type: | LGA |
| Number of Positions or Pins (Grid): | 3647 |
| Pitch - Mating: | 0.039" (1.00mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 30.0µin (0.76µm) |
| Contact Material - Mating: | Copper Alloy |
| Mounting Type: | Surface Mount |
| Features: | Open Frame |
| Termination: | Solder |
| Pitch - Post: | 0.034" (0.86mm) |
| Contact Finish - Post: | Gold |
| Contact Finish Thickness - Post: | 30.0µin (0.76µm) |
| Contact Material - Post: | Copper Alloy |
| Housing Material: | Thermoplastic |
| Operating Temperature: | - |
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ||
| 12 | ||
| 36 | ||
| 60 | ||
| 108 |
Current price of 2-2822979-4 is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com
CONN TRANSIST TO-3 4POS GOLD
CONN IC DIP SOCKET 14POS GOLD
CONN IC DIP SOCKET 14POS GOLD
RES 4.12 KOHM 0.1% 1/16W 0603
CONN SOCKET LGA 3647POS GOLD
CONN RCPT MALE 56POS GOLD CRIMP
CONN PLUG W/SOCKETS