
| Type | Description |
|---|---|
| Series: | Textoolâ„¢ |
| Package: | Bulk |
| Part Status: | Active |
| Type: | QFN |
| Number of Positions or Pins (Grid): | 40 (4 x 10) |
| Pitch - Mating: | - |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | - |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Closed Frame |
| Termination: | Solder |
| Pitch - Post: | - |
| Contact Finish - Post: | Gold |
| Contact Finish Thickness - Post: | - |
| Contact Material - Post: | Beryllium Copper |
| Housing Material: | Polyethersulfone (PES) |
| Operating Temperature: | - |
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ||
| 10 | ||
| 25 | ||
| 50 | ||
| 100 |
Current price of 240-5205-00 is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com
CONN IC DIP SOCKET 18POS GOLD
CONN IC DIP SOCKET 16POS GOLD
CONN IC DIP SOCKET 20POS GOLD
RES SMD 9.09 KOHM 0.5% 1/2W 1210
FIXED IND 15UH 2.2A 70 MOHM TH
CONN SOCKET QFN 40POS GOLD
HEX UNSLOTTED BOLT, M5 X .8 THRE