
| Type | Description |
|---|---|
| Series: | Textoolâ„¢ |
| Package: | Bulk |
| Part Status: | Active |
| Type: | QFN |
| Number of Positions or Pins (Grid): | 60 (4 x 15) |
| Pitch - Mating: | 0.020" (0.50mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | - |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Open Frame |
| Termination: | Solder |
| Pitch - Post: | 0.020" (0.50mm) |
| Contact Finish - Post: | Gold |
| Contact Finish Thickness - Post: | - |
| Contact Material - Post: | Beryllium Copper |
| Housing Material: | Polyethersulfone (PES) |
| Operating Temperature: | - |
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ||
| 20 |
Current price of 260-5204-01 is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com
CONN IC DIP SOCKET 10POS GOLD
CONN SOCKET SIP 16POS GOLD
CONN SOCKET SIP 34POS TIN
RESISTOR THIN FILM 1210 SIZE 1%
TERM BLOCK HDR 6POS VERT 3.81MM
CONN SOCKET QFN 60POS GOLD
1PH CURRENT TXFORM 500AAC