
| Type | Description |
|---|---|
| Series: | 55 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing |
| Number of Positions or Pins (Grid): | 40 (2 x 20) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Tin |
| Contact Finish Thickness - Mating: | 200.0µin (5.08µm) |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Closed Frame |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Tin |
| Contact Finish Thickness - Post: | 200.0µin (5.08µm) |
| Contact Material - Post: | Beryllium Copper |
| Housing Material: | Polyphenylene Sulfide (PPS), Glass Filled |
| Operating Temperature: | - |
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ||
| 25 | ||
| 100 | ||
| 500 | ||
| 1000 |
Current price of 40-6554-10 is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com
CONN IC DIP SOCKET 18POS GOLD
CONN SOCKET PLCC 68POS TIN
CONN IC DIP SOCKET 48POS GOLD
FIXED IND 10UH 950MA 300 MOHM
TRIMMER 50 OHM 0.5W PC PIN TOP
CONN IC DIP SOCKET ZIF 40POS TIN
RES SMD 22 OHM 5% 1W 2512