
| Type | Description |
|---|---|
| Series: | 110 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | DIP, 0.6" (15.24mm) Row Spacing |
| Number of Positions or Pins (Grid): | 36 (2 x 18) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 29.5µin (0.75µm) |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Open Frame |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Tin |
| Contact Finish Thickness - Post: | - |
| Contact Material - Post: | Brass |
| Housing Material: | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
| Operating Temperature: | -55°C ~ 125°C |
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ||
| 209 |
Current price of 110-83-636-41-001101 is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com
CONN IC DIP SOCKET 18POS GOLD
CONN SOCKET SIP 26POS GOLD
CONN IC DIP SOCKET 48POS GOLD
CRYSTAL 33.3330MHZ 7PF SMD
XTAL OSC TCXO 106.2500MHZ LVDS
CONN PLG HSG MALE 57POS INLINE
CONN IC DIP SOCKET 36POS GOLD