
| Type | Description |
|---|---|
| Series: | Textool™ |
| Package: | Bulk |
| Part Status: | Active |
| Type: | SOIC |
| Number of Positions or Pins (Grid): | 28 (2 x 14) |
| Pitch - Mating: | - |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | - |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Closed Frame |
| Termination: | Solder |
| Pitch - Post: | - |
| Contact Finish - Post: | Gold |
| Contact Finish Thickness - Post: | 30.0µin (0.76µm) |
| Contact Material - Post: | Beryllium Copper |
| Housing Material: | Polyethersulfone (PES), Glass Filled |
| Operating Temperature: | -55°C ~ 150°C |
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ||
| 10 | ||
| 25 | ||
| 50 | ||
| 100 | ||
| 250 |
Current price of 228-7396-55-1902 is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com
CONN IC DIP SOCKET 40POS TIN
CONN IC DIP SOCKET 20POS TINLEAD
CONN IC DIP SOCKET 32POS GOLD
CONN SOCKET SOIC 28POS GOLD
CABLE ASSEMBLY M12 DBL END 10M
RF SHIELD 0.75" X 3.75" T/H