
| Type | Description |
|---|---|
| Series: | Textoolâ„¢ |
| Package: | Bulk |
| Part Status: | Active |
| Type: | QFN |
| Number of Positions or Pins (Grid): | 80 (4 x 20) |
| Pitch - Mating: | 0.020" (0.50mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | - |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Open Frame |
| Termination: | Solder |
| Pitch - Post: | 0.020" (0.50mm) |
| Contact Finish - Post: | Gold |
| Contact Finish Thickness - Post: | - |
| Contact Material - Post: | Beryllium Copper |
| Housing Material: | Polyethersulfone (PES) |
| Operating Temperature: | - |
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ||
| 10 | ||
| 25 | ||
| 50 | ||
| 100 |
Current price of 280-5205-01 is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com
CONN IC DIP SOCKET 14POS GOLD
CONN IC DIP SOCKET 14POS TIN
CONN IC DIP SOCKET ZIF 40POS GLD
RES 182K OHM 1% 1/3W 0402
XTAL OSC VCXO 216.0000MHZ HCSL
CONN SOCKET QFN 80POS GOLD
8-BIT ADC, FLASH METHOD