
| Type | Description |
|---|---|
| Series: | 57 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing |
| Number of Positions or Pins (Grid): | 32 (2 x 16) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Tin |
| Contact Finish Thickness - Mating: | 200.0µin (5.08µm) |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Closed Frame |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Tin |
| Contact Finish Thickness - Post: | 200.0µin (5.08µm) |
| Contact Material - Post: | Beryllium Copper |
| Housing Material: | Polyphenylene Sulfide (PPS), Glass Filled |
| Operating Temperature: | - |
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ||
| 10 |
Current price of 32-6574-10 is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com
RIGHT SEGMEN LGA4189-4 SOCKET-P4
MACHINE PIN SOCKET, IC, DIP, 18P
CONN IC DIP SOCKET 48POS TIN
XTAL OSC VCXO 223.0000MHZ LVDS
MEMS OSC XO 20.0000MHZ LVCMOS LV
CONN IC DIP SOCKET ZIF 32POS TIN
FIXED IND 270NH 410MA 720 MOHM