
| Type | Description |
|---|---|
| Series: | - |
| Package: | Bulk |
| Part Status: | Active |
| Type: | LGA |
| Number of Positions or Pins (Grid): | 2011 (47 x 58) |
| Pitch - Mating: | 0.040" (1.02mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 30.0µin (0.76µm) |
| Contact Material - Mating: | Copper Alloy |
| Mounting Type: | Surface Mount |
| Features: | Open Frame |
| Termination: | Solder |
| Pitch - Post: | 0.035" (0.90mm) |
| Contact Finish - Post: | Gold |
| Contact Finish Thickness - Post: | 30.0µin (0.76µm) |
| Contact Material - Post: | Copper Alloy |
| Housing Material: | Thermoplastic |
| Operating Temperature: | - |
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ||
| 10 | ||
| 25 | ||
| 50 | ||
| 100 | ||
| 250 | ||
| 500 |
Current price of 2174988-2 is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com
CONN IC DIP SOCKET 36POS GOLD
CONN IC DIP SOCKET 12POS GOLD
CONN SOCKET SIP 35POS GOLD
RES SMD 13.5K OHM 0.1% 1/5W 1005
RES 200M OHM 1% 16.8W AXIAL
CONN SOCKET LGA 2011POS GOLD
FERRI SSD MODULE M.2 (22X42MM) S