
| Type | Description |
|---|---|
| Series: | Textool™ |
| Package: | Bulk |
| Part Status: | Active |
| Type: | SIP, ZIF (ZIP) |
| Number of Positions or Pins (Grid): | 10 (1 x 10) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 30.0µin (0.76µm) |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | - |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Gold |
| Contact Finish Thickness - Post: | 30.0µin (0.76µm) |
| Contact Material - Post: | Beryllium Copper |
| Housing Material: | Polysulfone (PSU), Glass Filled |
| Operating Temperature: | -55°C ~ 125°C |
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ||
| 10 | ||
| 25 | ||
| 50 | ||
| 100 | ||
| 250 |
Current price of 210-2599-00-0602 is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com
CONN IC DIP SOCKET 28POS GOLD
CONN IC DIP SOCKET 32POS GOLD
CONN IC DIP SOCKET 32POS GOLD
CRYSTAL 24.5760MHZ 12PF SMD
CONN SOCKET SIP ZIF 10POS GOLD
RES SMD 3.6M OHM 5% 1/8W 0805
CONN RCPT FMALE 19POS GOLD SLDR