
| Type | Description |
|---|---|
| Series: | 116 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | DIP, 0.4" (10.16mm) Row Spacing |
| Number of Positions or Pins (Grid): | 24 (2 x 12) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 29.5µin (0.75µm) |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Elevated, Open Frame |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Tin |
| Contact Finish Thickness - Post: | - |
| Contact Material - Post: | Brass |
| Housing Material: | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
| Operating Temperature: | -55°C ~ 125°C |
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ||
| 204 |
Current price of 116-83-424-41-007101 is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com
CONN SOCKET SIP 8POS GOLD
CONN IC DIP SOCKET 28POS TIN
CONN IC DIP SOCKET 10POS GOLD
FIXED IND 1.5UH 1.55A 63MOHM SMD
FIXED IND 820NH 12.9A 5.78 MOHM
CONN IC DIP SOCKET 24POS GOLD
FERRITE BEAD 31 OHM 1210 1LN