
| Type | Description |
|---|---|
| Series: | BU-178HT |
| Package: | Tube |
| Part Status: | Active |
| Type: | DIP, 0.3" (7.62mm) Row Spacing |
| Number of Positions or Pins (Grid): | 8 (2 x 4) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 78.7µin (2.00µm) |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Surface Mount |
| Features: | Open Frame |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Copper |
| Contact Finish Thickness - Post: | Flash |
| Contact Material - Post: | Brass |
| Housing Material: | Polybutylene Terephthalate (PBT), Glass Filled |
| Operating Temperature: | -55°C ~ 125°C |
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ||
| 10 | ||
| 25 | ||
| 52 | ||
| 104 | ||
| 260 | ||
| 520 | ||
| 1040 | ||
| 2548 |
Current price of BU080Z-178-HT is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com
CONN IC DIP SOCKET 24POS GOLD
CONN IC DIP SOCKET 50POS GOLD
CONN IC DIP SOCKET 68POS GOLD
CONN IC DIP SOCKET 8POS GOLD
CONN PLUG FMALE 12POS CRIMP
SMA-SP/TNC-RJ RG58 0.25M
RFID DEMO CASE WITH LAPTOP