
| Type | Description |
|---|---|
| Series: | DILB |
| Package: | Tube |
| Part Status: | Active |
| Type: | DIP, 0.6" (15.24mm) Row Spacing |
| Number of Positions or Pins (Grid): | 32 (2 x 16) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Tin-Lead |
| Contact Finish Thickness - Mating: | 100.0µin (2.54µm) |
| Contact Material - Mating: | Copper Alloy |
| Mounting Type: | Through Hole |
| Features: | Open Frame |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Tin-Lead |
| Contact Finish Thickness - Post: | 100.0µin (2.54µm) |
| Contact Material - Post: | Copper Alloy |
| Housing Material: | Polyamide (PA), Nylon |
| Operating Temperature: | -55°C ~ 125°C |
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ||
| 10 | ||
| 25 | ||
| 50 | ||
| 100 | ||
| 250 | ||
| 500 | ||
| 1000 | ||
| 2500 |
Current price of DILB32P-223TLF is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com
CONN IC DIP SOCKET 12POS GOLD
CONN IC DIP SOCKET 16POS GOLD
CONN IC DIP SOCKET 32POS GOLD
CONN HEADER VERT 20POS 2.54MM
CONN IC DIP SOCKET 32POS TINLEAD
IC CHIP
IC CHIP