
| Type | Description |
|---|---|
| Series: | 116 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | DIP, 0.6" (15.24mm) Row Spacing |
| Number of Positions or Pins (Grid): | 32 (2 x 16) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 29.5µin (0.75µm) |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Elevated, Open Frame |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Tin |
| Contact Finish Thickness - Post: | - |
| Contact Material - Post: | Brass |
| Housing Material: | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
| Operating Temperature: | -55°C ~ 125°C |
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ||
| 143 |
Current price of 116-83-632-41-008101 is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com
CONN IC DIP SOCKET 32POS GOLD
CONN IC DIP SOCKET 52POS GOLD
CONN IC DIP SOCKET 40POS GOLD
CRYSTAL 80.0000MHZ 8PF SMD
ZERO INSERTION FORCE 1MM ASSY
CONN IC DIP SOCKET 32POS GOLD
MINI HOOK TO MINI HOOK 39.4"