
| Type | Description |
|---|---|
| Series: | 500 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | DIP, 0.6" (15.24mm) Row Spacing |
| Number of Positions or Pins (Grid): | 32 (2 x 16) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 25.0µin (0.63µm) |
| Contact Material - Mating: | Copper Alloy |
| Mounting Type: | Through Hole |
| Features: | Closed Frame |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Gold |
| Contact Finish Thickness - Post: | 25.0µin (0.63µm) |
| Contact Material - Post: | Copper Alloy |
| Housing Material: | Polyester |
| Operating Temperature: | -55°C ~ 125°C |
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ||
| 375 |
Current price of 532-AG10D is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com
CONN IC DIP SOCKET 18POS GOLD
CONN IC DIP SOCKET 42POS GOLD
CONN IC DIP SOCKET 8POS GOLD
CONN HEADER SMD 48POS 2.54MM
CONN IC DIP SOCKET 32POS GOLD
LOGIC IC OUTPUT OPTOCOUPLER, 500
FIXED IND 15MH 260MA 21.9 OHM TH