
| Type | Description |
|---|---|
| Series: | 116 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | DIP, 0.4" (10.16mm) Row Spacing |
| Number of Positions or Pins (Grid): | 32 (2 x 16) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 29.5µin (0.75µm) |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Elevated, Open Frame |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Tin |
| Contact Finish Thickness - Post: | - |
| Contact Material - Post: | Brass |
| Housing Material: | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
| Operating Temperature: | -55°C ~ 125°C |
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ||
| 143 |
Current price of 116-83-432-41-009101 is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com
CONN SOCKET PLCC 44POS TIN
CONN IC DIP SOCKET 4POS GOLD
CONN IC DIP SOCKET 6POS GOLD
CONN IC DIP SOCKET 32POS GOLD
HEX STANDOFF M3X0.5 BRASS 8MM
DC DC CONVERTER 5V 400W
FIXED IND 75NH 500MA 520 MOHM