
| Type | Description |
|---|---|
| Series: | 510 |
| Package: | Tube |
| Part Status: | Active |
| Type: | SIP |
| Number of Positions or Pins (Grid): | 20 (2 x 10) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Tin |
| Contact Finish Thickness - Mating: | - |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Closed Frame |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Tin |
| Contact Finish Thickness - Post: | 20.0µin (0.51µm) |
| Contact Material - Post: | Copper |
| Housing Material: | Thermoplastic, Polyester |
| Operating Temperature: | - |
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ||
| 720 |
Current price of 2-1571995-0 is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com
CONN IC DIP SOCKET 10POS GOLD
CONN IC DIP SOCKET 24POS GOLD
CONN IC DIP SOCKET 8POS GOLD
RES SMD 510K OHM 1% 1/32W 01005
RES 953 OHM 0.1% 1/16W 0603
CONN SOCKET SIP 20POS TIN
EVAL MODULE FOR TS3DDR32611