
| Type | Description |
|---|---|
| Series: | 115 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | DIP, 0.4" (10.16mm) Row Spacing |
| Number of Positions or Pins (Grid): | 20 (2 x 10) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 29.5µin (0.75µm) |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Open Frame |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Tin |
| Contact Finish Thickness - Post: | - |
| Contact Material - Post: | Brass |
| Housing Material: | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
| Operating Temperature: | -55°C ~ 125°C |
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ||
| 400 |
Current price of 115-83-420-41-003101 is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com
CONN IC DIP SOCKET 32POS GOLD
CONN SOCKET SIP 23POS GOLD
CONN IC DIP SOCKET 28POS GOLD
MEMS OSC XO 66.6660MHZ LVCMOS LV
CONN RCPT 60POS 0.1 GOLD SMD
CONN IC DIP SOCKET 20POS GOLD
FIXED IND 18MH 21MA 175 OHM TH