
| Type | Description |
|---|---|
| Series: | Textool™ |
| Package: | Bulk |
| Part Status: | Active |
| Type: | SOIC |
| Number of Positions or Pins (Grid): | 14 (2 x 7) |
| Pitch - Mating: | - |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | - |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Closed Frame |
| Termination: | Solder |
| Pitch - Post: | - |
| Contact Finish - Post: | Gold |
| Contact Finish Thickness - Post: | 30.0µin (0.76µm) |
| Contact Material - Post: | Beryllium Copper |
| Housing Material: | Polyethersulfone (PES), Glass Filled |
| Operating Temperature: | -55°C ~ 150°C |
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ||
| 10 | ||
| 25 | ||
| 50 | ||
| 100 | ||
| 250 | ||
| 500 |
Current price of 214-7390-55-1902 is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com
CONN IC DIP SOCKET 22POS GOLD
CONN SOCKET TRANSIST 3POS GOLD
CONN IC DIP SOCKET 16POS TIN
MEMS OSC XO 35.8400MHZ LVCMOS LV
CONN CARDEDGE MALE 8POS 0.100
CONN SOCKET SOIC 14POS GOLD
FAN 92X25MM 24VDC RBLS TACH