
| Type | Description |
|---|---|
| Series: | Textool™ |
| Package: | Tray |
| Part Status: | Active |
| Type: | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing |
| Number of Positions or Pins (Grid): | 28 (2 x 14) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 30.0µin (0.76µm) |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Connector |
| Features: | Closed Frame |
| Termination: | Press-Fit |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Gold |
| Contact Finish Thickness - Post: | 30.0µin (0.76µm) |
| Contact Material - Post: | Beryllium Copper |
| Housing Material: | Polysulfone (PSU), Glass Filled |
| Operating Temperature: | -55°C ~ 125°C |
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ||
| 10 | ||
| 30 | ||
| 50 | ||
| 100 | ||
| 250 |
Current price of 228-1371-00-0602J is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com
CONN SOCKET SIP 48POS GOLD
CONN IC DIP SOCKET 10POS GOLD
CONN IC DIP SOCKET 24POS GOLD
FIXED IND 390UH 180MA 3.4OHM SMD
CONN HEADER SMD 72POS 2.54MM
CONN IC DIP SOCKET ZIF 28POS GLD
IMAGE SENS CMOS 1MP 1/4 8X7 IBGA