| Type | Description |
|---|---|
| Series: | Textool™ |
| Package: | Bulk |
| Part Status: | Active |
| Type: | DIP, ZIF (ZIP) |
| Number of Positions or Pins (Grid): | 90 (2 x 45) |
| Pitch - Mating: | 0.070" (1.78mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 30.0µin (0.76µm) |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Closed Frame |
| Termination: | Solder |
| Pitch - Post: | 0.070" (1.78mm) |
| Contact Finish - Post: | Gold |
| Contact Finish Thickness - Post: | 30.0µin (0.76µm) |
| Contact Material - Post: | Beryllium Copper |
| Housing Material: | Polysulfone (PSU), Glass Filled |
| Operating Temperature: | -55°C ~ 125°C |
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ||
| 10 | ||
| 25 | ||
| 50 | ||
| 100 | ||
| 250 |
Current price of 290-1294-00-3302J is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com
CONN IC DIP SOCKET 16POS TIN
CONN IC DIP SOCKET 22POS GOLD
CONN IC DIP SOCKET 40POS GOLD
MEMS OSC XO 33.3333MHZ LVCMOS LV
MEMS OSC XO 47.2500MHZ LVPECL
CONN IC DIP SOCKET ZIF 90POS GLD
DC DC CONVERTER 10V 75W
