
| Type | Description |
|---|---|
| Series: | 110 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | DIP, 0.3" (7.62mm) Row Spacing |
| Number of Positions or Pins (Grid): | 22 (2 x 11) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 29.5µin (0.75µm) |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Open Frame |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Tin |
| Contact Finish Thickness - Post: | - |
| Contact Material - Post: | Brass |
| Housing Material: | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
| Operating Temperature: | -55°C ~ 125°C |
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ||
| 342 |
Current price of 110-83-322-41-001101 is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com
CONN IC DIP SOCKET 30POS GOLD
CONN IC DIP SOCKET 20POS GOLD
CONN IC DIP SOCKET 18POS GOLD
XTAL OSC VCXO 148.425787MHZ
MEMS OSC XO 133.3330MHZ LVCMOS
CONN IC DIP SOCKET 22POS GOLD
CONN JACKSCREW ASSY LOW PROFILE