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Type | Description |
---|---|
Series: | 110 |
Package: | Tube |
Part Status: | Obsolete |
Type: | DIP, 0.4" (10.16mm) Row Spacing |
Number of Positions or Pins (Grid): | 22 (2 x 11) |
Pitch - Mating: | 0.100" (2.54mm) |
Contact Finish - Mating: | Gold |
Contact Finish Thickness - Mating: | 30.0µin (0.76µm) |
Contact Material - Mating: | Beryllium Copper |
Mounting Type: | Through Hole |
Features: | Open Frame, Decoupling Capacitor |
Termination: | Solder |
Pitch - Post: | 0.100" (2.54mm) |
Contact Finish - Post: | Gold |
Contact Finish Thickness - Post: | 10.0µin (0.25µm) |
Contact Material - Post: | Brass Alloy |
Housing Material: | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
Operating Temperature: | -55°C ~ 125°C |
ERL-07 24.9K 2% T-1 RLR07C2492GS
MEMS OSC XO 19.2000MHZ H/LV-CMOS
CONN HEADR 29POS .100 PCB TIN
CONN IC DIP SOCKET 22POS GOLD